The process of semiconductor manufacturing involves numerous intricate subprocesses, each with its own set of challenges. Various sensors capture a wide range of data, including tool profiles, temperatures, pressures, and more. The ultimate goal is to produce a flawless semiconductor wafer. However, if any subprocess malfunctions, it can lead to a loss in yield, rendering the entire batch useless and resulting in significant financial losses, potentially amounting to millions of dollars. Identifying the specific subprocess responsible for the yield loss is therefore critical.